As AI systems become more advanced, memory is required to transfer larger amounts of data at higher speeds. But conventional planar semiconductor scaling is running out of room. A KAIST research team has now addressed a key weakness in three-dimensional, vertically stacked memory devices, opening a new path to faster, more power-efficient AI semiconductors.As AI systems become more advanced, memory is required to transfer larger amounts of data at higher speeds. But conventional planar semiconductor scaling is running out of room. A KAIST research team has now addressed a key weakness in three-dimensional, vertically stacked memory devices, opening a new path to faster, more power-efficient AI semiconductors.Hardware[#item_full_content]